IC載板載體銅箔剝離機在IC載板制造工序中，自動撕除panel表面的Carrier Copper Foil的設(shè)備。
可適應In Line或Off Line。
在產(chǎn)品垂直的狀態(tài)下撕 除保護銅箔，構(gòu)造上防止resin導致的二次污染，銅箔會進行單獨回收。
Used in the PCB manufacturing process, this equipment will detach the Carrier Copper Foil automatically. It is feasible to set the equipment In line and Off line. Detach the Carrier Copper Foil vertically and prevent the panel from secondary resin pollution, and the Carrier Copper Foil will be collected automatically.? DCDS 200 / DCDS 300 設(shè)備規(guī)格 Product size(mm) 415mm(W) * 510mm(L) [ MODEL: DCDS 200 ] 510mm(W) * 610mm(L) [ MODEL: DCDS 300 ] Product thickness(mm) Carrier Foil : 12/12, 18/18, Core : 0.03~0.4mm Tact time 22sec [ MODEL: DCDS 200 ] Tact time 25sec [ MODEL: DCDS 300 ] Facility structure L/UN, Separator unit??? Alarm, Safety? Tower lamp, Emergency switch, Door lock Utility Electric: 3phase 220V, 50/60Hz, Air Pressure: 5~6Kgf/ Facility size 2,100mm(W) * 5,720mm(L) * 2,760mm(H) [ MODEL: DCDS 200 ] 2,300mm(W) * 5,920mm(L) * 2,860mm(H) [ MODEL: DCDS?300 ] 重量 Loader - 1200Kg (1300 kg) Separator - 1400Kg (1500 kg) Unloader - 1000Kg (1100 kg) 標簽： 封裝基板 銅箔剝離 core ? 封裝基板銅箔剝離機 銅箔剝離機 coreless銅箔剝離 ? 深圳市載板銅箔剝離機 ? 深圳市載板銅箔剝離機廠家

廣東 深圳市[封裝基板銅箔剝離機 銅箔剝離機 coreless銅箔剝離] 深圳市載板銅箔剝離機廠家
IC載板銅箔剝離機